DONGGUAN DAEJOO ELECTRONIC MATERIALS CO.,LTD

DONGGUAN DAEJOO ELECTRONIC MATERIALS CO.,LTD

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Semiconductor Packaging MaterialsDSA Series & DUF Series


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Semiconductor Packaging MaterialsDSA Series & DUF Series

Die Attach Adhesives for Semiconductor Package : Curing Type DSA series are one component themosettic adhesives composed of electrically conduc-tive silver (or silica) and highly themally resistant resins. They are used in semiconductorpackaging process or microelectrionic assembly. We produce various cure types andproperties of die attaches. And our die attaches will give your product high resiability.

Description

半导体封装材料