PRODUCT
PRODUCT
Semiconductor Packaging MaterialsDSA Series & DUF Series
Semiconductor Packaging MaterialsDSA Series & DUF Series
Die Attach Adhesives for Semiconductor Package : Curing Type
DSA series are one component themosettic adhesives composed of electrically conduc-tive silver (or silica) and highly themally resistant resins. They are used in semiconductorpackaging process or microelectrionic assembly. We produce various cure types andproperties of die attaches. And our die attaches will give your product high resiability.
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