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PRODUCT
Silicone & Epoxy Encapsulant, Silicone Diebond for SMD LED
Silicone & Epoxy Encapsulant, Silicone Diebond for SMD LED
DCS-100A/B, DJS-8800A/B is a two-component silicone resin for SMD LED and photodiode packaging. It has excellent heat resistance and good transmittance from 450mm to the courseware wavelength range.
DCS-5000 is a two-component hardened epoxy resin for SMD LED and photodiode packaging. It has excellent heat resistance and good transmittance in the wavelength range from 4500mm to courseware.
DCS-2000 is used in LED packaging engineering or microelectronic assembly engineering, with a variety of curing types and different bonding properties, and can make customers' products highly reliable.
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